Company Strength R.F. & Microwave subsystems, equipment, components, devices and materials used in Modems, Receivers, Transmitters, Up- and Down-Converter technology for Wireless applications, Active, Adaptive and Passive Phased Array Antenna technology for Communication and Radar systems - Ground mobile, Ground Fixed and Satellite based
• Integrated and discrete Silicon, SiGe and GaAs semiconductor devices and fabrication technology,
• SOC, Integrated Circuits (RFIC, MIC and MMIC) technologies for PA and TxRx chipset.
Hybrid Multi-chip (Small Signal & Power) Modules and T/R Modules, Microwave Packaging, Interconnects, Thin-film fabrication technology, RF cable technology, Surface Mount technology and PCB assembly technology | Customer and Partner testimonials Semiconductor Semiconductor Start-ups, OEM/ODM Carriers |